JPH01146524U - - Google Patents
Info
- Publication number
- JPH01146524U JPH01146524U JP4397988U JP4397988U JPH01146524U JP H01146524 U JPH01146524 U JP H01146524U JP 4397988 U JP4397988 U JP 4397988U JP 4397988 U JP4397988 U JP 4397988U JP H01146524 U JPH01146524 U JP H01146524U
- Authority
- JP
- Japan
- Prior art keywords
- photoresist
- wafer surface
- wafer
- coating machine
- dropped onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4397988U JPH01146524U (en]) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4397988U JPH01146524U (en]) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146524U true JPH01146524U (en]) | 1989-10-09 |
Family
ID=31270359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4397988U Pending JPH01146524U (en]) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146524U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006518931A (ja) * | 2003-02-20 | 2006-08-17 | アーエスエムエル ホールディング ナームローゼ フェンノートシャップ | マルチシリンジ流体分配システムを用いて半導体処理溶液を分配する方法及び装置 |
-
1988
- 1988-03-31 JP JP4397988U patent/JPH01146524U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006518931A (ja) * | 2003-02-20 | 2006-08-17 | アーエスエムエル ホールディング ナームローゼ フェンノートシャップ | マルチシリンジ流体分配システムを用いて半導体処理溶液を分配する方法及び装置 |
| US7485346B2 (en) | 2003-02-20 | 2009-02-03 | Asml Netherlands B.V. | Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems |
| KR101028520B1 (ko) * | 2003-02-20 | 2011-04-11 | 에이에스엠엘 홀딩 엔.브이. | 다중-주사기 유체 전달 시스템을 이용한 반도체 처리 용액주입 방법 및 장치 |
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